Surface Mount PCB Assembly is a procedure in electronic manufacturing in which electronic circuits are produced. This is done by placing the modules in direct contact of the surface of PCB/ Printed Circuit Board.
Surface Mounting was originally knows as planar mounting. Earlier, the method that was applied was the fitting of components in the printed circuit board with the wires punched through a hole. This was the ‘through-hole technology’ that was largely followed. But over the years, this has been replaced by the SMT PCB Assembly mode.
Surface Mount Printed Circuit Board Assembly is basically a technique of packaging of the circuit board where on top of the board lead wires or chips or pins (the several components) are soldered on. In the case of the SMT PCB Assembly, they are considered to be faster and efficient than the ‘through hole’ technology of placing the pins. The lead chips and pins are soldered directly through the board and are placed underneath it. Because of this method no holes are drilled atop the board and the real estate underneath the device can also be put to use on other layers of boards.
The Surface mount component can vary from smaller pins or lead chips or even solder balls. The BGA Assembly, in other words- Ball Grid Array-is another popular chip. This is basically used for integrated circuits as they provide more interconnected pins. As a result, the whole surface area as well as the bottom surface of the board can be utilized. The ball leads are shorter in size and they are soldered in the board with precise automated process. Thus, they are very efficient and provide one with a higher speed.