Printed Circuit Boards can be assembled in mainly two processes namely, Surface Mount PCB Assembly and Plated Through Hole PCB Assembly. The difference in the processes lies in the way the component leads are placed on the board. Here is a glimpse into the various steps which we at Denis Ferranti apply to make a PCB assembly.
Surface Mount PCB Assembly or SMT
In a SMT or Surface Mount PCB assembly we attach the various electronic components to the surface of the board. This entails four main steps which include soldering paste onto the board, picking the components and placing them, soldering and final testing of the components to check their functionality. The solder paste in SMT PCB assembly is put on the connection pads which in turn hold the components. Once this is done the solder paste is inserted into a reflow furnace for melting. This is important to establish the mechanical and electrical connection which is the ultimate function of the electrical component leads on a PCB.
Plated Through Hole Technology
In this method the component leads, instead of being placed atop the connection pads are inserted into the board by making holes. The insertion procedure undertaken at Denis Ferranti is done through computerized and automated insertion systems which are capable of inserting both axial and dip component leads. Wave soldering is done after all the components have been inserted for uniform and smooth solder flow.
We also undertake metal backed PCB Assembly which has witnessed a high demand in a number of applications. Here board is made up of a base metal, generally copper or aluminum which helps in faster heat transferring, thus keeping the components cool and providing them a longer life span.
For any type of PCB Assembly, call our experts or get in touch with us at: http://www.dferrantielectronics.co.uk